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This is the layer map for the technology codes SCN5M_SUBM and SCN5M_DEEP using the MOSIS Scalable CMOS layout rules ( SCMOS), and only for SCN5M_SUBM and SCN5M_DEEP. For designs that are laid out using other design rules (or technology-codes), use the standard layer mapping conventions of that design rule set. For submissions in GDS format, the datatype is "0" (zero) unless specified in the map below.
SCN5M_SUBM: Scalable CMOS N-well, 5 metal, 1 poly, thick oxide option, and supports silicide block. MiM (Cap_Top_Metal, also known as Metal 4 Prime, to Metal 4) capacitors are available. Uses revised layout rules for better fit to sub-micron processes (see section 2.4)
SCN5M_DEEP: Uses revised layout rules for better fit to deep sub-micron processes (see section 2.4)
Fabricated on TSMC 0.25 micron process runs.
Layer | GDS | CIF | CIF Synonym |
Rule
Section |
Notes |
N_WELL | 42 | CWN |   | 1 | |
ACTIVE | 43 | CAA | 2 | ||
THICK_ACTIVE | 60 | CTA | 24 | Optional | |
POLY | 46 | CPG | 3 |
|
|
SILICIDE_BLOCK | 29 | CSB | 20 | Optional | |
N_PLUS_SELECT | 45 | CSN | 4 | ||
P_PLUS_SELECT | 44 | CSP | 4 | ||
CONTACT | 25 | CCC | CCG | 5, 6 | |
POLY_CONTACT | 47 | CCP | 5 | Can be replaced by CONTACT | |
ACTIVE_CONTACT | 48 | CCA | 6 | Can be replaced by CONTACT | |
METAL1 | 49 | CM1 | CMF | 7 |
|
VIA | 50 | CV1 | CVA | 8 |
|
METAL2 | 51 | CM2 | CMS | 9 |
|
VIA2 | 61 | CV2 | CVS | 14 | |
METAL3 | 62 | CM3 | CMT | 15 | |
VIA3 | 30 | CV3 | CVT | 21 | |
METAL4 | 31 | CM4 | CMQ | 22 | |
CAP_TOP_METAL | 35 | CTM | 28 | Optional | |
VIA4 | 32 | CV4 | CVQ | 25 | |
METAL5 | 33 | CM5 | CMP | 26 | |
DEEP_N_WELL | 38 | CDNW | 31 | ||
GLASS | 52 | COG | 10 |
|
|
PADS | 26 | XP |
|
Non-fab layer used to highlight pads | |
Comments | -- | CX | Comments |