Vias must be drawn orthogonal to the grid of the layout. Non-Manhattan vias are not allowed.
Rule | Description | Lambda | ||
---|---|---|---|---|
6 Metal Process | ||||
SCMOS | SUBM | DEEP | ||
29.1 | Exact size | n/a | 3 x 3 | 4 x 4 |
29.2 | Minimum spacing | n/a | 4 | 4 |
29.3 | Minimum overlap by Metal5 | n/a | 1 | 1 |
Any designer using the SCMOS rules who wants the TSMC Thick_Top_Metal must draw the top metal to comply with the TSMC rules for that layer.
Rule | Description | Lambda | ||
6 Metal Process | ||||
SCMOS | SUBM | DEEP | ||
30.1 | Minimum width | n/a | 5 | 5 |
30.2 | Minimum spacing to Metal6 | n/a | 5 | 5 |
30.3 | Minimum overlap of Via5 | n/a | 1 | 2 |
30.4 | Minimum spacing when either metal line is wider than 10 lambda | n/a | 10 | 10 |