Vias must be drawn orthogonal to the grid of the layout. Non-Manhattan vias are not allowed.
Rule | Description | Lambda | |||||
---|---|---|---|---|---|---|---|
5 Metal Process | 6+ Metal Process | ||||||
SCMOS | SUBM | DEEP | SCMOS | SUBM | DEEP | ||
25.1 | Exact size | n/a | 2x2 | 3x3 | n/a | 2x2 | 3x3 |
25.2 | Minimum spacing | n/a | 3 | 3 | n/a | 3 | 3 |
25.3 | Minimum overlap by Metal4 | n/a | 1 | 1 | n/a | 1 | 1 |
Any designer using the SCMOS rules who wants the TSMC Thick_Top_Metal must draw the top metal to comply with the TSMC rules for that layer.
Rule | Description | Lambda | |||||
---|---|---|---|---|---|---|---|
5 Metal Process | 6+ Metal Process | ||||||
SCMOS | SUBM | DEEP | SCMOS | SUBM | DEEP | ||
26.1 | Minimum width | n/a | 4 | 4 | n/a | 3 | 3 |
26.2 | Minimum spacing to Metal5 | n/a | 4 | 4 | n/a | 3 | 4 |
26.3 | Minimum overlap of Via4 | n/a | 1 | 2 | n/a | 1 | 1 |
26.4 | Minimum spacing when either metal line is wider than 10 lambda | n/a | 8 | 8 | n/a | 6 | 8 |